Showing results: 106 - 120 of 232 items found.
-
M9033A -
Keysight Technologies
The M9033A PXIe System Synchronization Module is a dual-slot, 5-port module that provides multi-module and multi-chassis synchronization and triggering for Keysight's modular instruments.
-
E9902G -
Keysight Technologies
Keysight's family of i3070 Series 6 In-Circuit Test (ICT) systems are built on a proven technology foundation, and they improve test efficiency with time-tested software, hardware, and programmability. I3070 Series 6 ICT tester supports a wide range of printed circuit board assembly (PCBA) sizes for applications including IoT and 5G, as well as automotive and energy. The i3070 features a unique design that delivers the shortest signal path between measurement circuitry and devices under test to minimize undesired effects from parasitic capacitance, improve immunity to crosstalk, and eliminate stray signal coupling effects, delivering consistent and repeatable measurements. The Series 6 is fully backward compatible with previous systems and makes highly repeatable measurements.
-
Chroma ATE Inc.
Double sided wafer inspection system is an automatic inspection system for afterdicing wafer chip. It can do double side inspection simultaneously. The appearance defects of wafer chip are clearly conspicuous by using advanced illumination technology. Illumination and camera acquisition mode can be adjusted for various wafer process, like vertical chip or flip chip.
-
TL2000 -
ficonTEC Service GmbH
ficonTEC’s series of testing machines is focused on automated electro-optical characterization ofsemiconductor chips. The ficonTEC TL2000 is a fully automated test and inspection system for unmountedlaser diode bars, single chips and chips on submounts.
-
Sentinel -
Jaeshininfo Co. Ltd
The first single system on chip module. Measures cell voltage, cell internal temperature and cell impedance.
-
R-Car -
Renesas Electronics Corp.
"R-Car" is the nickname for Renesas' system-on-chip (SoC) family for car information systems designed for the next-generation of automotive computing for the age of autonomous vehicles.
-
Wind River
With Wind River® Simics® you can simulate anything, chip to system, giving you a path to DevOps and Continuous Integration and Deployment.
-
Wewon Environmental Chambers Co, Ltd.
Probe card manufacturing need the semiconductor test equipment. When we designed the thermal testing equipment, Only some commonly used test items are packaged into the IC tester, and the logic function of the verification chip is implemented in a fixed test mode. But as chip products diversify, Some thermal inducing system can no longer do it alonehttps://www.wewontech.com/semiconductor-test-equipment/
-
KLA-Tencor Corp
KLA’s metrology systems address a range of chip and substrate manufacturing applications, including verification of design manufacturability, new process characterization and high volume manufacturing process monitoring. By providing precise measurement of pattern dimensions, film thicknesses, layer-to-layer alignment, pattern placement, surface topography and electro-optical properties, our comprehensive set of metrology systems allows chip manufacturers to maintain tight control of their processes for improved device performance and yield.
-
CSE Co.,Ltd
Vertical Probe Card. (Mobile D-RAM, L.D.I Flip Chip 60um Pitch,. System LSI, Soc Devices). Cantilever Probe Card. Low Leakage Probe Card.
-
BCM91250E -
Broadcom Limited
The BCM91250E is a full-length PCI evaluation board with the SiByte® BCM1250 dual-processor System on a Chip. The board is designed for software development and for developing PCI applications that require high-performance processors.
-
ComEth4070e -
ELMA Electronic, Inc.
The ComEth 4070e is a cutting-edge 6U Layer 2/3 Ethernet switch for VME64x systems. Powered by the newest Marvell highly integrated system-on-chip (SoC) with programmable packet processors.
-
ASML
Chips are made up of many layers stacked on top of one another, and it’s not necessarily the latest and greatest immersion lithography machines that are used to produce these layers. In a given chip, there may be one or two more complicated layers that are made using an EUV lithography machine, but the rest can often be printed using ‘older’ technology such as dry lithography systems. This is certainly more cost-effective for customers, since these older machines are less expensive to purchase and maintain. Read about how dry lithography systems are enabling progress.
-
MediaLB System -
Microchip Technology Inc.
A MediaLB system consists of several MediaLB devices and one MediaLB controller (typically an INIC chip). The INIC serves as a transceiver for the MOST network and as a controller for MediaLB, which assures synchronization to the MOST network.
-
Exodus Advanced Communications
Exodus Pulse SSPA products feature LDMOS and GaN discrete and Chip & Wire technologies covering frequency ranges from 1MHz to 12GHz at power levels exceeding 1KW for Modules and 10KW for Systems.